How the Walther-Meißner-Institute is using a standardized Indium Bump Interconnect process on an automated FINEPLACER® femto 2 to successfully manufacture Superconducting Qubit-based Quantum Processors.
The Walther-Meißner-Institute for Low Temperature Research (WMI) is a research institute of the Bavarian Academy of Sciences and Humanities (BAdW).
Among other fields, the WMI conducts fundamental and applied research in the field of low and ultra-low temperature physics with special focus on quantum systems and quantum computing, as well as magnetism, superconductivity and spintronics. It also develops low and ultra-low temperature methods and measurement techniques for characterizing quantum systems, as well as methods for the growth of single crystals and thin film structures.
The WMI is situated in Garching near Munich, frequently referred to as the “Isar Valley”, as many companies and organizations have been moving their main research and development facilities to this area in the last years.
High accuracy die bonder needed to build 100 Qubits quantum processors
In 2023, the WMI started investigating in die bonder systems, looking to add die bonding capabilities needed for a research project dealing with Superconducting Qubit-based Quantum Processors for Quantum Computing.
The requirements of building processor designs achieving 100 functional Qubits and more demanded sub-micron accuracy bonding of delicate Indium bump interconnects, superior precision in handling all process-related parameters such as co-planarity and flatness, as well as precisely controlling the bond line gap.
The WMI was looking for a supplier capable of providing on-going support in process development. Being able to find a partner who can take care of the application’s die bonding aspects would allow the WMI to focus on the intricacies of the Quantum chip design and fabrication.
What is more, the WMI was requesting for an all-in-one system, easy to program and operate. Ideal for a changing circle of qualified users, as this research institute has a high throughput of PhD and Masters students who would be potentially using the machine each year for dedicated and parallel projects.
When investigating the market, the WMI found that, even on paper, only two die bonder suppliers were able to meet the requirements of the application – one of them was Finetech.
Automated Standardized Indium Bump Interconnect Bonding Process and more
Upon reaching out to Finetech, the WMI came to the Berlin cleanroom facilities for demo trials with their own samples. In live bonding sessions including cleaning routines and pattern recognition programming, they could get a real feel for the machine and see that it was up to the challenge.
Due to the extremely high value of the bonded components, process reproducibility is key. As only a few functional components are fabricated each cycle, it must have the highest likelihood of success. Considering this, the WMI decided on a fully automated FINEPLACER® femto 2 system.
The WMI found that going with Finetech had several benefits:
- Finetech introduced the WMI to a standardized, easy-to-use, very efficient cold compression bonding solution for fine pitch micro Indium bump array interconnects, which is production-ready as it is designed to handle several assemblies at once.
- Due its modular and expandable architecture, the FINEPLACER® femto 2 was the future-proof solution, as the accuracy requirements continue to increase, and the machine might be used in other projects with different application requirements.
- The WMI acknowledged that the Finetech application and product experts had a profound understanding of the application implications, which are not limited to die bonding.
- The WMI was specifically convinced by the fact that Finetech took care and provided dedicated solutions to secondary and tertiary application challenges, e.g. material kitting and chemical or plasma cleaning.
- The regional proximity, quick service response and a direct hotline to the application experts gave the WMI the confidence that Finetech was the ideal partner for this ambitious project.
Successful partnership in the pursuit of advancing quantum computing
Supported by Finetech, the WMI gained access to a standardized Indium Bump Interconnect solution for the assembly of high-end quantum processor chips.
Center piece is the automated sub-micron die bonder FINEPLACER® femto 2, which is crucial for the WMI to conduct trial bonds and ramping up fabrication capabilities for high-end superconducting Quantum processors. To further scale up production rates, the WMI plans to further develop chip stacking and fan-out packaging designs.
As this is a very dynamic technological field, Finetech is keeping the WMI up to date with new solutions like plasma cleaning, as well as continuous refinements to the machine hardware and software modules.
In an ambitious project like this, a close and trustful cooperation is very important. Between the WMI and Finetech, this has been a major factor of success and allows for a continuously growing partnership in the pursuit of advancing quantum computing technology.
