Sub Micron Die Bonders

For basic research and prototype assembly, Finetech offers manually and semi-automated table-top bonders. Processes which have been qualified during development can be transferred to automation without technology change or changeover effort and scaled for production on one of the automated systems.

All FINEPLACER^® bonders can be configured to provide optimal process environments and assembly capabilities for specific applications. Our portfolio of systems vary in automation, resolution, accuracy, die and substrate handling to suit your particular needs.