Your partner for precision die bonding and process development
Driven by over 30 years of engineering excellence, we presented our latest die bonding solutions for advanced packaging, photonics, and semiconductor applications – from high-precision manual systems to fully automated production platforms.
Visitors experienced how Finetech’s innovative technologies enable precise, reliable, and flexible micro assembly across the entire die packaging value chain.
We look forward to seeing you again in 2027.
Exclusive Preview – a first look at the future of die bonding
Our visitors became part of Finetech’s innovation journey. The new production platform is still in development – but we’re ready to share an exclusive first preview. Our guests discovered how next-generation automation, wafer handling, and bonding technologies are coming together – and their feedback will help shape what’s next.
Your partner for precision die bonding and process development
Driven by over 30 years of engineering excellence, we present our latest die bonding solutions for advanced packaging, photonics, and semiconductor applications – from high-precision manual systems to fully automated production platforms.
Experience how Finetech’s innovative technologies enable precise, reliable, and flexible micro assembly across the entire die packaging value chain.
Visit us at Hall B2, Booth 405.
Exclusive Preview – get a first look at the future of die bonding
Be part of Finetech’s innovation journey. Our new production platform is still in development – but we’re ready to share an exclusive first preview. Discover how next-generation automation, wafer handling, and bonding technologies are coming together – and help us shape what’s next.
Product Highlights & Live Demos
FINEPLACER® femto family
Automated die bonders for advanced packaging needs.
Seamless transition from prototype to high-yield production. All the precision you need. Long-term process stability. Covered die attach technologies include:
- Cold/Thermocompression Bonding (e.g. Indium Bump)
- Adhesive/Epoxy Bonding/UV Curing
- Eutectic Bonding
FINEPLACER® lambda 2
Precision bonding in research and development with process flexibility and sub-micron accuracy
Ideal for labs and prototyping environments, precise, hands-on control across a wide range of die attach technologies:
- 2.5D and 3D IC Packaging (Stacking)
- Thermo- / Ultrasonic Bonding
- Adhesive Bonding
Live Talk – advanced die packaging for quantum technologies
Sylvain Dulphy explained how precision die bonding is shaping the next generation of quantum devices, from superconducting processors and photonic chips to quantum communication systems. In this talk, he highlighted why sub-micron placement accuracy, cryogenic-grade bond reliability and flexible multi-process capabilities are becoming essential as quantum technologies move from research labs into scalable production.
The full recording of his presentation is now available!
Tradeshow Impressions
Explore our post-tradeshow gallery and relive the excitement of Productronica 2025. Our highlights include the launch of our new production bonder — a next-generation solution in die bonding technology, our iconic FINEPLACER® femto 2 automatic die bonder machine with newly added features, along with our FINEPLACER® lambda 2 manual semi-automated system. Discover moments from the unveiling, live demos, and insightful meetings that deepened customer connections.
