Finetech, a leading provider of high-precision die attach and bonding equipment, announced its participation in Photonics West 2025, the world’s premier photonics technologies event, taking place in San Francisco from January 28-30.
At booth 4772, Finetech will showcase its latest advancements in die bonding technology, including live demonstrations of the FINEPLACER® femto 2, a fully automated sub-micron bonder designed for demanding applications in photonics, optics, and microelectronics.
With over 30 years of experience in developing customized equipment and process solutions, Finetech offers a seamless path from product development to automated production. The FINEPLACER® femto 2 exemplifies this commitment to innovation, providing unparalleled accuracy and flexibility for a wide range of die bonding applications. Featuring a placement accuracy of 0.3 µm @ 3 sigma, the system is ideally suited for high-precision assembly processes in photonics packaging, where accuracy and reliability are paramount.
“Photonics West is a crucial platform for us to connect with industry leaders and showcase our latest innovations,” says Neil O’Brien, General Manager Finetech USA. “The FINEPLACER® femto 2 represents a significant leap forward in die bonding technology, enabling our customers to achieve new levels of precision and efficiency in their production processes.”
Key Features of the FINEPLACER® femto 2:
- Unrivaled Accuracy: Achieves a placement accuracy of 0.3 µm @ 3 sigma, ensuring precise and reliable die bonding for even the most demanding applications.
- Complete Machine Enclosure: Provides a controlled environment for sensitive processes, protecting the bonding process from external influences and maximizing yield.
- Advanced Vision Alignment: The new FPXvision™ system, combined with refined pattern recognition, offers exceptional flexibility and accuracy in component placement.
- Intuitive Software: IPM Command, the FINEPLACER® operating software, supports consistent, ergonomic, and clearly structured process development
- Modular Design: Allows for customized configurations and easy retrofitting to adapt to evolving application requirements.
In addition to showcasing the FINEPLACER® femto 2, Finetech will also highlight its comprehensive range of process development and prototyping services. The company’s experienced application engineering team provides expert support in developing and optimizing assembly processes, collaborating with customers in state-of-the-art cleanroom facilities.
“Our goal is to be a trusted partner for our customers throughout their entire product development journey,” adds Neil O’Brien. “From initial concept to high-volume production, we provide the expertise and technology necessary to bring their product vision to life.”
To schedule a consultation with a process specialist at Photonics West 2025, get in touch here.
