The Fastest FINEPLACER® for Production!
At Laser World of Photonics, we proudly unveil our fastest die bonder yet — the FINEPLACER® femto pro. Engineered for precision and versatility in production with a focus on reduced cost-per-bond and significantly increased throughput.
With 30+ years of expertise, our modular die bonders enable tailored configurations, fast upgrades, and long-term adaptability. Each system is co-developed with customers to meet specific photonics challenges like Silicon Photonics, Photonic Integrated Circuits, Co-Packaged Optics, Quantum Photonics, and more.
Discover how our innovation supports your process — from prototype to production — with expert guidance and 100% commitment.
Live Demonstration
Be among the first to experience the fastest FINEPLACER® ever designed for production.
The FINEPLACER® femto pro is an automated die bonder that blends unmatched speed with the precision and accuracy synonymous with the FINEPLACER® femto line.
- Future-proof solution for advanced packaging
- Tailored for your process needs
- Industry leading bonding quality
Master precision bonding in research and development with process flexibility and sub-micron accuracy
Ideal for labs and prototyping environments, the FINEPLACER® lambda 2 empowers users with precise, hands-on control across a wide range of micro assembly applications.
- Designed for process development and hands-on innovation
- Tailored for unmatched placement accuracy in a compact footprint
- Modular platform ensuring versatility in R&D
Be among the first to experience the fastest FINEPLACER® ever designed for production.
The FINEPLACER® femto pro is an automated die bonder that blends unmatched speed with the precision and accuracy synonymous with the FINEPLACER® femto line.- Future-proof solution for advanced packaging
- Tailored for your process needs
- Industry leading bonding quality
Master precision bonding in research and development with process flexibility and sub-micron accuracy
Ideal for labs and prototyping environments, the FINEPLACER® lambda 2 empowers users with precise, hands-on control across a wide range of micro assembly applications.
- Designed for process development and hands-on innovation
- Tailored for unmatched placement accuracy in a compact footprint
- Modular platform ensuring versatility in R&D
Why Finetech?
✓ Expertise Beyond Measure: We are the die bonding experts who thrive on challenges. Your obstacles become our opportunities to help you, and together, we achieve remarkable results.
✓ Tailored Solutions: No two projects are the same. That’s why we offer customized solutions, providing you with machines and processes designed to fit your unique requirements.
✓ From Concept to Market: Our “Prototype-to-Production” approach enables fast, low-risk flexible product development and seamless process transfer from R&D to production.
✓ Accuracy Redefined: For us, accuracy goes beyond placement accuracy. It’s a commitment to perfection in every aspect of die bonding.
✓ Lifelong Flexibility: Our support doesn’t end with a sale. We are dedicated to offering flexibility throughout your machine’s lifecycle, ensuring it adapts to your changing needs.
We are here for you
At Laser World of Photonics 2025 in Munich, we will advise you on how to successfully implement your project. Make an appointment today.