最先端サブミクロン精度ダイボンディング装置 – FINEPLACER® sigma

四半世紀に渡ってお客様の要求から多くの見識を頂きました。この経験により要求仕様に対して的確なプロセスと装置の開発に寄与しました。

Silitronics uses a Finetech die bonder for extremely complex flip chip, sensor and opto-electronics applications, along with co-development of new assembly processes for leading semiconductor customers. The bonder has allowed us to help customers develop, optimize, verify and enhance many state-of-the-art technologies. Our partnership with Finetech has been very rewarding and their willingness to provide constructive application support in a timely manner, along with their design and manufacture of quality custom tooling, are second to none.