最新情報とプレスリリース

At this year’s Productronica (November 18–21, 2025), Finetech GmbH & Co. KG invites visitors to discover the future of precision die bonding and micro-assembly in Hall B2, Booth 405.

Finetech announces the debut of its fastest production die bonder to date at LASER World of PHOTONICS 2025.

After many successful years as a subsidiary of Finetech, Martin GmbH will cease operations in May 2025.

Finetech introduces the FINEPLACER^® femto pro, the next-generation automated die bonder for high-yield and sustainable mid-volume production.

Finetech announced its participation in Photonics West 2025, the world’s premier photonics technologies event, taking place in San Francisco from January 28-30.

As the holiday season approaches, we at Finetech w